Top Chinese memory chip maker YMTC makes another design breakthrough, defying US sanctions
Yangtze Memory Technologies Corporation is integrating a new design into chips with 294 gates, research firm finds

Yangtze Memory Technologies Co (YMTC), China’s leading flash memory chip manufacturer, has achieved a significant technological breakthrough despite US sanctions, amid Beijing’s push for technological self-sufficiency, according to a report by TechInsights.
YMTC has implemented its new Xtacking4.0 memory chip design in its highest-density 3D NAND chip, which was discovered in the commercial ZhiTai TiPro9000 solid-state storage device, according to a recent report from Canadian integrated circuit (IC) research firm TechInsights.
The chip features a dual-deck structure – a lower deck with 150 gates and an upper deck with 144 gates – totalling 294 gates. It uses what is known as a hybrid-bonding technique to join two wafers together.
Following last year’s release of Xtacking4.0 devices such as YMTC’s 160-layer product, industry observers anticipated the company would incorporate this architecture into products with higher layer counts.