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Huawei paper shows Tau Scaling Law chip solves overheating ahead of Kirin 2026 launch
The research directly counters claims that vertical stacking creates a thermal bottleneck, the tech giant’s paper says
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Ann Caoin Shanghai
Huawei Technologies has released a new research paper showing its Tau Scaling Law-based semiconductor architecture can avoid overheating, which analysts view as a key technical hurdle for its anticipated Kirin 2026 smartphone chip.
The paper, authored by He Tingbo, chairwoman of the Huawei Scientist Committee and president of the company’s semiconductor business department, rebutted scepticism that vertically stacking logic circuits would create an insurmountable thermal bottleneck.
It was published on Friday on ChinaXiv, a publication platform for scientific papers that have yet to be peer reviewed.
Despite heat being “the sharpest concern on Tau Scaling Law”, the company’s measurements for its new Kirin chip “turned that objection upside down”, He wrote.
The paper said the Kirin 2026 chip ran cooler than its predecessor, while packing 55 per cent more transistors per square millimetre and cutting power use by up to 66 per cent on some key tasks.
The new chip reduces power consumption while increasing transistor density, allowing it to flexibly switch between functional constraints and peak performance
The new chip reduces power consumption while increasing transistor density, allowing it to flexibly switch between functional constraints and peak performance
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