China’s No 2 chip foundry Hua Hong names former Intel veteran as new president
Bai has over 30 years of semiconductor fabrication experience and previously held executive positions at various chipmakers, including Intel
China’s Hua Hong Semiconductor, the country’s second-largest chip foundry, has hired a former Intel veteran as its new president amid a management reshuffle.
The Shanghai-based chipmaker, which specialises in mature node technology, said in a stock filing on Thursday that it hired Intel’s former global vice-president Bai Peng, 62, as its new president on a three-year contract. Bai will take over the president’s role from Tang Junjun, who will remain chairman and executive director of Hua Hong Semiconductor.
Bai has over 30 years of semiconductor fabrication experience and previously held executive positions at various chipmakers, including US chip giant Intel. Bai attended China’s prestigious Peking University and later received his bachelor’s degree in physics in 1985 from the University of Bucharest, Romania. He earned his doctorate in physics from Rensselaer Polytechnic Institute in New York State, according to his official biography.
Bai was recently chief executive at Rong Semiconductor (Ningbo) Co, a foundry producing image sensors, power management chips, and display drivers using mature node technology from 28-nanometre to 180-nm. Before that, he held positions at Intel as process integration engineer, yield engineering director, R&D director and vice-president, and then global vice-president, according to the filing.