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Chinese chip-equipment maker CFMEE targets US$410 million in Hong Kong IPO

The Hefei-based firm has attracted 17 cornerstone investors and plans to use proceeds for R&D, acquisitions and expansion

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Circuit Fabology Microelectronics Equipment's headquarters in Hefei, Anhui province. The chip-equipment maker is heading to Hong Kong's stock market amid China's drive for semiconductor self-sufficiency. Photo: CFMEE
Richard Chen

Chinese lithography and integrated circuit manufacturer Circuit Fabology Microelectronics Equipment (CFMEE) is set to launch a Hong Kong listing next week, as China continues its drive for semiconductor self-sufficiency amid US sanctions.

The company, based in Hefei, Anhui province, said on Wednesday that it would offer more than 12.8 million H shares globally at a price range of HK$240.09 to HK$252.73 apiece, raising up to HK$3.2 billion (US$410 million).

The offer period will run until next Tuesday, with trading expected to begin on the Hong Kong stock exchange on June 26.

The IPO in Hong Kong has attracted 17 cornerstone investors, which have subscribed for at least 43 per cent of the offer. They include entities affiliated with the Hefei municipal government, JPMorgan Asset Management (Asia-Pacific), and HHLR Advisors under Hillhouse Investment.

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