Connectec ushers in next-generation gadgetry with Monster PAC

Connectec Japan is ushering in a new era of semiconductor assembly with packaging technology that can enable next-generation gadgetry. Developed over five years of intense engineering, Connectec's Monster PAC-typeC delivers the high-performance, low-cost combination that the industry has been looking for.

"Conventional packaging technology cannot support the fragile wafers that will be increasingly used to make high-speed, next-generation electronic devices," says Katsunori Hirata, CEO of Connectec Japan. "Our process innovation ensures damage-free bonding while enabling higher performance. This technology provides a path to the future when even innovative and ultrafine-pitch LSI [large-scale integration] will be used."

Monster PAC-typeC combines ceramic substrates and soft flip chip bonding to reach above 10 gigahertz (GHz) frequency and power dissipation up to eight watts. Conventional packaging technology only takes power dissipation up to three watts and frequency to three GHz. Next-generation devices require above five GHz to achieve low signal loss and more than five watts allowable power.

Connectec's process innovation in Monster PAC-typeC brings production costs down by 30 per cent as it requires less equipment, factory floor area and power consumption. It also shortens lead time to two days, as the simplified processing can be done in less than one second.

Aside from consumer electronics, Connectec's packaging technology has applications in the vehicle and medical industries. The company is also expanding damage-free bonding to organic, film, module, package-on-package and micro-electromechanical systems. These factors elicited excitement at international trade shows held earlier this year in Japan, South Korea, on the mainland, Taiwan and San Francisco.

Aiming to leverage deep Japanese know-how and engineers to promote further industry innovation, the company seeks research and development opportunities in Asia.